Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material

A new junction termination technique: The Deep Trench Termination (DT2)

Numerous techniques have been used to improve the voltage handling capability of high voltage power devices with the aim to obtain the breakdown of a plane junction. In this work, a new concept of low cost, low surface and high efficiency junction termination for power devices is presented and experimentally validated. This termination is based on a large and deep trench filled by BCB (BenzoCyc...

Ageing mechanisms in Deep Trench Termination (DT2) Diode

Embedded benzocyclobutene in silicon: An integrated fabrication process for electrical and thermal isolation in MEMS

This paper reports a novel fabrication process to develop planarized isolated islands of benzocyclobutene (BCB) polymer embedded in a silicon substrate. Embedded BCB in silicon (EBiS) can be used as an alternative to silicon dioxide in fabrication of electrostatic micromotors, microgenerators, and other microelectromechanical devices. EBiS takes advantage of the low dielectric constant and ther...

Integration of Benzocyclobutene Poymers and Silicon Micromachned Structures Fabricated with Anisotropic Wet Etching

Title of thesis: INTEGRATION OF BENZOCYCLOBUTENE POYMERS AND SILICON MICROMACHNED STRUCTURES FABRICATED WITH ANISOTROPIC WET ETCHING Nima Ghalichechian, Master of Science, 2005 Thesis directed by: Professor Reza Ghodssi Department of Electrical and Computer Engineering Integration of low dielectric constant Benzocyclobutene (BCB) film with deep etched structures in silicon allows the fabricatio...

An Investigation on the Effects of Optimum Forming Parameters in Hydromechanical Deep Drawing Process Using the Genetic Algorithm

The present research work is concerned with the effects of optimum process variables in elevated temperature hydro-mechanical deep drawing of 5052 aluminum alloy. Punch-workpiece and die-workpiece friction coefficients together with the initial gap between the blank holder and matrix were considered as the process variables which, in optimization terminology, are called design parameters. Since...